We are seeking a senior mechanical engineer for a role focused on electronics packaging.
Specific responsibilities include:
• Perform mechanical design and development associated with the physical arrangement of electronic circuits including assembly design, analysis, build, test, and documentation support
• Execute the design, tolerance analysis, evaluation, or failure analysis of assigned projects using mechanical design principles
• Drive solutions to complex, customer driven problems with limited direction – develop requirements, propose ways forward when customer requirements are unclear or incomplete, and adapt appropriately to changes in requirements
• Communicate effectively and openly with multi-disciplinary program teams, senior management, and sponsors
• Track record of leading teams of 3 or more people to accomplish program goals, developing time/budgetary estimates, and mentoring junior engineers
• Strong organization, planning and time management skills to achieve program goals
Required Qualifications:
• Bachelor of Science degree with 7+ years of experience in a relevant field such as mechanical engineering, materials science, or manufacturing engineering
• Master of Science degree with 5+ years of experience in a relevant field such as mechanical engineering, materials science, or manufacturing engineering
• Team player able to work in a fast-paced environment with demonstrated ability to handle multiple competing tasks and demands
• Experience with materials, fabrication, and assembly techniques associated with printed circuit assemblies including surface mount technology, high density substrates, rigid-flex designs, and integrated circuit assembly
• Experience designing/directing the physical layout of electrical circuits including SMD, interconnect definition, and integrated circuit assembly techniques
• Experience designing in 3D CAD using SolidWorks and/or CREO
Preferred Qualifications:
• Experience with analysis tools such as ANSYS, COMSOL, and/or MatLab
• Familiarity with machine shop tools and processes, prototyping, and vendor coordination
• Experience writing proposals, executing feasibility studies, and generating ROM estimates of system performance/size, weight, power/cost with imperfect or incomplete information
• Current in-scope TOP SECRET security clearance is required